Ultrasonic transducer of highest quality for all bonding applications in microelectronics:

• Fine (thin) wire wedge-wedge bonding

• Fine (thin) wire ball-wedge bonding

• TAB bonding

• Heavy (thick) wire bonding

• Thick ribbon bonding

• Ultrasonic (flip-chip) die bonding

• Customized transducer:

• Please send your inquiry to info@fkphysiktechnik.com.

• Frequency range from 40 kHz to 150 kHz

• best materials

• carefully selected piezos for best stability

• Transducer "Made in Germany"

Ultrasonic transducer of highest quality for power applications

• Frequency range from 30 kHz to 150 kHz

• best materials

• carefully selected piezos for best stability

• Transducer "Made in Germany"

• Didn't find a suitable model?
• We develop the right transducer for you.

• Please send your inquiry to info@fkphysiktechnik.com.

The ultrasonic generator family of choice:

• to be used with any ultrasonic transducer model for wire and die bonding machines

• for all power levels, starting with very thin wire bonding up to heavy ribbon bonding (HARB)

• Can be used with ultrasonic transduers of all brands

• full digital control loops

• digital PLL (Phase Lock Loop)

• digital power control loop

• digital triggering (bond power & bond time)

• direct digital synthesis of the ultrasound

• Measurement functions available during the bond cycle

• Transducer current

• Transducer voltage

• Impedance

• Remark: Scope of measurement options depending on the generator model. Further measured variables on request.

UUG-050-S

• Frequency range: (40 - 200) kHz
• Max. output voltage: 11,5 Vrms
• Standard type

UUG-050-U

• Frequency range: (40 - 200) kHz
• Max. output voltage: 11,5 Vrms
• Replacement model for Uthe 10H-P2

UUG-050-N

• Frequency range: (40 - 200) kHz
• Max. output voltage: 11,5 Vrms
• for PHICOM ball bonder

UUG-050-B

• Frequency range: (40 - 150) kHz
• Max. output voltage: 25 Vrms
• extended output power
• also suitable for die bonding (low bump counts)

• More information:
• Data sheet UUG-050 series

UUG-040-S

• Frequency range: (30 - 150) kHz
• Max. output voltage: 39 Vrms
• Standard type for heavy wire bonding
• Die bonding of small and medium bump counts

• More information:
• Data sheet UUG-040

UUG-050-X

• Frequency range: (40 - 200) kHz
• Max. output voltage: 100 Vrms
• for heavy ribbon bonding (HARB)
• for die bonding at high bond forces and high bump counts

• More information:
• Data sheet UUG-050-X

• Didn't find a suitable model?
• Please contact us if you couldn't find a suitable generator for your application in this list. We also offer customer-specific adaptation of existing systems and special developments according to your requirements.

• Selection of realized generators for our customers:

• Wire bond generators
• Die bond generators
• Generators for wafer bonding
• Generators for chemical and biological processing
• Generators for measurement applications

• Please send inquiries to info@fkphysiktechnik.com.

Fields of Application TTS-030 Accessories

The standard tool for the process engineer to:

• secure and improve the bonding quality

• increase the yield of the bond process

• reduce bond failure rate

• increase bond machine uptime

• Every ultrasonc transducer for wire and die bond machines can be checked

• independent from machine model and brand

• easy to use

• Gathering of all essential measured variables:

  • Resonance frequency

  • Impedance

  • Phase angle

• can be combined with optical vibration excursion measuring systems of the ODS series

• Accessories to extend scope of possibilities

• Acquisition and documentation of the electrical properties of the ultrasonic system of the bonding machine

• preventive maintenance by regular checking

• objective research for the root cause of ultrasound-related bonding problems

• independent verification of the machine-internal status information for the ultrasonic system

• documentation of the current machine status in the quality management system (QMS)

• Research on the impact of the bonding tool on the ultrasonic transducer

• proper selection of the bonding tool to the bond process

• Training of machine operators and service employees

• efficient tool for visualizing the results of work on the ultrasound system

• identify changes caused by maintenance work

• learning to change tools correctly

• Income control for ultrasonic transducers

• Transducer Test Set

• external (outside of the bond head) measurement of transducer
  (e.g. during income control of spare transducers)

• set of clamps for common barrel diameters
  (0,5“ - 0,6“ - 0,75“ - 13mm & 16mm)

• micromanipulator with holder for standard ODS sensor

• custom-made clamps on request

• Transport and storage case TTS-ODS

• for TTS-030, ODS-20/ODS-21 and accessories

• TTS-Transducer cable for different transducer models

• for F&K Delvotec G4 wire bonder

• for F&K Delvotec G5 wire bonder

• for KnS and ASM ball bonder

• Custom-made TTS-Transducer cable on request

Field of Applications ODS-20 ODS-21 Accessories

The standard tool for the process engineer to:

• determine the vibration amplitude of the bonding tool

• carry out a vibration excursion based calibration of the ultrasonic system of a bond machine

• evaluate the efficiency of the ultrasonic transducer
  to convert electrical energy into mechanical vibration

• Check correct execution of a tool change

• Optional: check and calibrate bond force unit of a bond machine
  (2-in1 system)

• determine vibration amplitude and vibration frequency of the ultrasonic transducer of a wire or die bonding machine

• contactless measurement (optical sampling)

• independent from machine model and brand

• easy to use

• standard sensor head suitable for most modern bond machines

• special sensor head designs available

• 2-in-1 system: measure vibration amplitude and bond force (optional) with one system

• Gathering of all relevant measured values

• Vibration amplitude (peak-peak)
• Vibration frequency
• Bond force (optional)

• can be combined with Transducer Test System TTS-030

• Accessories for erweiterte Nutzungsmöglichkeiten

• Vibration excursion based calibration of the ultrasonic system of bond machines

• same parameter set for same product on all machines (of same model)

• Gathering and documentation of the actual vibration amplitude at the bonding tool of the bond machine

• preventive maintenance by regular checking

• objective research for the root cause of ultrasound-related bonding problems

• documentation of the current machine status in the quality management system (QMS)

• Evaluate the impact of the bonding tool to the ultrasonic transducer

• proper selection of the bonding tool to the bond process
• determine the natural frequencies of the bond tool by combination with the Transducer Test System TTS-030

• Training of machine operators and service employees

• identify changes due to maintenance work on the bond head
• learning to change tools correctly

• Optionally available force measuring allows checking and calibration of the bond force unit of the bonding machine

• Transducer Test Set

• external (outside of the bond head) measurement of transducer
  (e.g. during income control of spare transducers)

• set of clamps for common barrel diameters
  (0,5“ - 0,6“ - 0,75“ - 13mm & 16mm)

• micromanipulator with holder for standard ODS sensor

• custom-made clamps on request

• Mikromanipulator with holder for standard ODS sensor

• for use at manual wire bonders (Hybond or similar)

• Special sensor head

• for Shinkawa ball bonder

• Special sensor head

• for TDK die bonder

Field of Applications BFS-20

The standard tool for the process engineer to:

• check the bond force unit of a bond machine

• calibrate the bond force unit of a F&K Delvotec bonder

• analyze the force development from touch down to lift off of the bond head

• Bond force measurement and documentation (static and dynamic measurements)

• independent from machien modle and brand
• easy to use
• standard sensor head suitable for most modern bond machines
• special sensor heads available

• Check the applied bond force

• static measurement

• Check the bond force development

• dynamic measurement
• touch down behaviour of the bond tool (bond head)
• stability of the applied bond force over full bond cycle

• Calibration of the bond force unit

• automatic calibration run on F&K Delvotec bonder using serial communication
• manual calibration for other brands, depending on the possibilities of the bonder model

LA-01MB-AK

The alignment tool to:

• quick and easy adjustment of optical experiments

• especially for experiments outside the visible spectrum

• Two accurate laser beams in opposite directions

• Rechargeable battery for simple operation

• compact design of the bi-directional alignment laser for easy integration into the optical experiment

Your service provider with:

• many years of expertise in ultrasonic technology in wire and die bonding

• experience in the development and production of digital ultrasonic systems for chip interconnections since 1996

• Please send inquiries with your task description to info@fkphysiktechnik.com,

• or give us a call.

• Phone: +49 331 60028920