Ultrasonic Technology for Chip Interconnection
Transducer Test System
TTS-030
Optical Displacement Measurement System
ODS-20
Optical Displacement Measurement System
(for K&S ball bond machines)
ODS-21
Bond Force Calibration System
(for F&K Delvotec bond machines)
BFS-20
Ultrasonic Transducer
Ball-Wedge-Transducer
Ultrasonic Transducer
Wedge-Wedge-Transducer
Ultrasonic Transducer
Heavy wire- & Diebond-Transducer
Ultrasonic Transducer
Power-Transducer
Digital Ultrasonic Generator
(fine wire)
UUG-050
Digital Ultrasonic Generator
(heavy/thick wire- & diebond)
UUG-040
Digital Ultrasonic Generator
(heavy wire, thick ribbon & diebond)
UUG-050-X
Digital Ultrasonic Generator
(plug-in cards & complete devices)
Customized Solutions
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Potsdam, February 2022
We proudly announce the release of the first members of our new Ultrasonic Power-Transducer series. Available working frequencies are approximately 35 kHz and 44 kHz.
Trade show update
PCIM Europe 2022 took place in Nürnberg as on-site show from May 10th to 12th, 2022.
We like to express our thanks to all visitors of our booth.
Information about the show and our displayed products can be found using the PCIM link.
About us
Since 2002 F&K Physiktechnik GmbH Potsdam has been developing and manufacturing products and processes
that are used worldwide for chip interconnection in microelectronic production.
F&K Physiktechnik GmbH focuses on ultrasound technology
Our customers apply our generators and transducers for their projects in ultrasonic wire bonding and ultrasonic die bonding.
In addition, we offer unique measurement technology for characterizing and optimally setting up ultrasonic systems in bonding machines.
System supplier for all users of ultrasonic bonding technology.
Product and service overview
Ultrasonic Transducer
Ultrasonic Transducer for all bonding technologies
Digital Ultrasonic Generators
Optimally adapted ultrasonic frequencies and powers for all bonding technologies
(also for transducers from other manufacturers)
Transducer Test System
Worldwide unique measurement system to determine the electrical properties of every ultrasonic transducer
Standard tool for checking the production equipment
Optical Displacement Measurement System - ODS-Series
Determine the vibration amplitude and frequency of the bonding tool by non-contact measurement
Vibration amplitude based calibration of the bonding machine for perfect machine matching
Ideal extension to the Transducer Test System
Bond Force Calibratioon System
Static and dynamic bond force measurements
Communication interface to F&K Delvotec wire bonders for automatic bond force calibration
Services
Your service provider with many years of expertise in ultrasound in wire and die bonding
Experience in the development and production of digital ultrasound systems for chip interconnection since 1996
Bi-directional Alignment Laser
The tool for quick and easy alignment of optical experiments,
especially for experiments outside the visible spectrum
Our product catalogue for downloading (approx. 9 MB)
F&K Products
If you have any questions, please email us at
info@fkphysiktechnik.com
Our responsible employee will contact you directly.
Address:
F&K Physiktechnik GmbH |
Wetzlarer Str. 54 |
14482 Potsdam |
Germany |
Contact person:
Mike Kölling